Epoxy System Xwrap Resin Putty (for levelling)
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The Component A of two-component epoxy putty is a thixotropic mixture of epoxy resins, reactive diluents, fillers, pigments and target additives. The Component B is a polyamine curing agent containing filler and specialty additives.
After curing it has the high level of strength parameters and adhesion to most engineering materials: concrete, natural and artificial stone, brick, steel, PVC, thermoplastic polyolefin. It eliminates defects with a depth of 1 to 15 mm
- Does not require separate priming compounds;
- Designed specifically for preparing the engineering structure surface to install the external reinforcement system based on carbon composite materials;
- High level of adhesion to various surfaces: concrete, metal, wood, brick;
- Thixotropy (when applied to vertical surfaces and horizontal laps, it does not slip or peel) when applying a layer up to 15 mm;
- High-wearing feature;
- High early curing strength.
Main parameters