Epoxy System Xwrap Resin Putty (for levelling)
The Component A of two-component epoxy putty is a thixotropic mixture of epoxy resins, reactive diluents, fillers, pigments and target additives. The Component B is a polyamine curing agent containing filler and specialty additives.
After curing it has the high level of strength parameters and adhesion to most engineering materials: concrete, natural and artificial stone, brick, steel, PVC, thermoplastic polyolefin. It eliminates defects with a depth of 1 to 15 mm